Optical test-points using engineered scattering elements in photonic integrated circuits
Photonic integrated circuits (PICs) fabricated in national foundries are becoming an increasingly valuable commodity for the technology industry. This talk will address important challenges in the test, assembly and packaging of PICs. A number of those challenges can be addressed through improved methods of non-contact testing. In particular, packaging of completed circuits requires evaluation of loss, polarization, and dispersion. In this talk I will describe recent progress in the design and application of foundry-compatible optical test points that can be interrogated with a short wave infrared camera.
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